This course is dedicated to the basics of micro-electro-mechanical systems modeling.
It contains a general and detailed description of the concepts, methods and tools available for modeling micro-electro-mechanical systems, including the necessary theoretical background.
The course lists and describes the relevant phenomena that influence the behavior of micro-electro-mechanical systems and addresses the couplings involved in MEMS models, such as electromechanics, the piezoelectric effect, the piezoresistive effect, electrostrictive and ferroelectroelastic effects, thermoelastic and fluid-film damping, bidirectional fluid-structure interaction (FSI), and hygroscopic swelling.
Applications include actuators, sensors, gyroscopes, accelerometers, quartz oscillators, resonators and microfluidic devices.
Topics covered include electromechanics, piezoelectric effect, piezoresistive, electrostrictive and ferroelectroelastic effects, thermoelastic and thin-film damping, bidirectional fluid-structure interaction, hygroscopic swelling and MEMS applications.
Image made using the COMSOL Multiphysics software and provided by courtesy of COMSOL.